Consumer Electronics & Hardware TSMC Weighs Major 20% Price Hike for Advanced CoWoS Packaging Amid Strained AI Capacity and Extended Equipment Lead Times October 27, 2026 Layla Zulfa Taiwan Semiconductor Manufacturing Company (TSMC), the world’s largest contract chipmaker, is reportedly considering raising prices for its advanced Chip on Wafer on Substrate (CoWoS) packaging technology by as much as…
